Samsung Electro-mechanics Co. has announced that it has made the world's thinnest semiconductor substrate.
Samsung Motor has been the world's top producer of semiconductor substrates. The thickness of the chip produced this time is 0.08mm, which is thinner than ordinary paper. The company claims that it can make 20-layer flash and SRAM chips using this technology.
A spokesperson for Samsung Electric said: "The gap between the circuits made by the new substrate can be up to 20 microns. The new product is made of copper material by special process."
Samsung Electric said that samples of the new substrate have been sent to semiconductor manufacturers around the world for testing. If the test passes, the product will be commercially available later this year.
Samsung Motor has been the world's top producer of semiconductor substrates. The thickness of the chip produced this time is 0.08mm, which is thinner than ordinary paper. The company claims that it can make 20-layer flash and SRAM chips using this technology.
A spokesperson for Samsung Electric said: "The gap between the circuits made by the new substrate can be up to 20 microns. The new product is made of copper material by special process."
Samsung Electric said that samples of the new substrate have been sent to semiconductor manufacturers around the world for testing. If the test passes, the product will be commercially available later this year.
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